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sensor solutions /// ms5837 - 30ba 03/12/2015 1 ms5837 - 30ba ultra small gel filled pressure sensor specifications ? ceramic - metal package, 3.3 x 3.3 x 2.75mm ? high - resolution module 0.2 mbar ? fast conversion down to 0.5 ms ? low power, 0.6 a (standby < 0.1 a at 25c) ? integrated digital pressure sensor (24 bit ? adc) ? supply voltage 1.5 to 3.6 v ? operating range: 0 to 30 bar, - 20 to +85 c ? i 2 c interface ? no external components (internal oscillator) ? excellent long term stability ? hermetically sealable for outdoor devices ? sealing designed for 1.8 x 0.8mm o - ring the ms5837 - 30ba is a new generation of high resolution pressure sensors with i 2 c bus interface for dept h measurement systems with a water depth resolut ion of 2 mm. the sensor module includes a high linearity pressure sensor and an ultra - low power 24 bit ? adc with int ernal factory calibrated coefficients. it provides a precise digit al 24 bit pressure and temperature value and different operation modes t hat allow the user to optimize for conversion speed and current consumption. a high resolution temperature output allows the implementation in depth measurement systems and thermometer function without any additional sensor. the ms5837 - 30ba can be interfac ed to virtually any microcontroller. the communication protocol is simple, without the need of programming internal registers in the device. the gel protection and antimagnetic stainless steel cap make the module water resistant. this new sensor module gen eration is based on leading mems technology and latest benefits from meas switzerland proven experience and know - how in high volume manufacturing, which has been widely used for over a decade.
ms5837 - 30ba ul tra small gel filled pressure sensor sensor solutions /// ms5837 - 30ba 03/12/2015 2 performance specifications absolute maximum rat ings parameter symbol conditions min. typ. max unit supply voltage v dd - 0.3 +4 v storage temperature t s - 40 +85 c overpressure p max iso 2281 0 50 bar maximum soldering temperature t max 40 sec max 250 c esd rating human body model - 2 +2 kv latch up jedec standard no 78 - 100 +100 ma electrical character istics parameter symbol conditions min. typ. max unit operating supply voltage v dd 1.5 3.0 3.6 v operating temperature t - 20 +25 +85 c supply current (1 sample per sec.) i dd osr 8192 4096 2048 1024 512 256 20.09 10.05 5.02 2.51 1.26 0.63 a peak supply current during conversion 1.25 ma standby supply current at 25c 0.01 0.1 a vdd capacitor from vdd to gnd 100 470 nf analog digital conve rter (adc) parameter symbol conditions min. typ. max unit output word 24 bit conversion time (1) t c osr 8192 4096 2048 1024 512 256 14.8 7.40 3.72 1.88 0.95 0.48 16.44 8.22 4.13 2.08 1.06 0.54 18.08 9.04 4.54 2.28 1.17 0.60 ms (1): maximum values must be applied to determine w aiting times in i2c communication
ms5837 - 30ba ul tra small gel filled pressure sensor sensor solutions /// ms5837 - 30ba 03/12/2015 3 performance specifications (continued) pressure output char acteristics (v dd = 3 v, t = 25c unle ss otherwise noted ) parameter conditions min. typ. max unit operating pressure range p range full accuracy 0 30 bar absolute accuracy (1), temperature range: 0 40c 0 6 bar 0 20 bar 0 30 bar - 50 - 100 - 200 +50 +100 +200 mbar absolute accuracy (1), temperature range: - 20 85c 0 6 bar 0 20 bar 0 30 bar - 100 - 200 - 400 +100 +200 +400 mbar maximum error with supply voltage (2) v dd = 1.5 v 3.6 v 30 mbar long - term stability 30 mbar/year resolution rms osr 8192 4096 2048 1024 512 256 0.20 0.28 0.38 0.54 0.84 1.57 mbar reflow soldering impact ipc/jedec j - std - 020d.1 (see application note an808 on http://meas - spec.com) - 8 mbar recovering time after reflow (3) 7 days (1) with autozero at one pressure point (2) with autozero at 3v point (3) time to recover at least 66% of the reflow impact. temperature output c haracteristics (v dd = 3 v, t = 25c unless otherwise noted) parameter conditions min. typ. max unit absolute accuracy 0 10 bar, 25c 0 10 bar, 0..60c - 20..85c - 1.5 - 2.0 - 4.0 +1.5 +2.0 +4.0 c maximum error with supply voltage v dd = 1.5 v 3.6 v 0.3 c resolution rms osr 8192 4096 2048 1024 512 256 0.0022 0.0026 0.0033 0.0041 0.0055 0.0086 c
ms5837 - 30ba ul tra small gel filled pressure sensor sensor solutions /// ms5837 - 30ba 03/12/2015 4 performance specifications (continued) digital inputs (scl, sda) parameter symbol conditions min. typ. max unit serial data clock scl 400 khz input high voltage v ih 80% v dd 100% v dd v input low voltage v il 0% v dd 20% v dd v input leakage current i leak25c at 25c 0.1 a digital outputs (sda ) parameter symbol conditions min. typ. max unit output high voltage v oh i source = 0.6 ma 80% v dd 100% v dd v output low voltage v ol i sink = 0.6 ma 0% v dd 20% v dd v
ms5837 - 30ba ul tra small gel filled pressure sensor sensor solutions /// ms5837 - 30ba 03/12/2015 5 performance characteristics pressure error vs pr essure and temperatu re temperature error vs pressure and tempera ture pressure and tempera ture error vs power supply
ms5837 - 30ba ul tra small gel filled pressure sensor sensor solutions /// ms5837 - 30ba 03/12/2015 6 functional description general the ms5837 - 30ba consists of a piezo - resistive sensor and a sensor interface ic. the main function of the ms5837 - 30ba is to convert the uncompensat ed analogue out put voltage from the piezo - resistive pressure sensor to a 24 - bit digital value, as well as providin g a 24 - bit digital value for the temperature of the sensor. factory calibration e very module is individually factory calibrated at two temperatures and two pressures. as a result, 6 coefficients necessary to compensate for process variations and temperat u re variations are calc ulated and stored in the 112 - bit prom of each module. these bits (partitioned into 6 coefficients w1 to w6) must be read by the microcontroller soft ware and used in the program converting d1 and d2 into compensated pressure and temper ature values. the coefficients w0 is for factory configuration and crc. serial i2c interface the external microcontroller clocks in the data through the input scl (serial clock) and sda (serial data). the sensor responds on the same pin sda which is bidir ectional for the i 2 c bus interface. so this interface type uses only 2 signal lines and does not require a chip select. module ref mode pins used ms5837 - 30ba i 2 c sda, scl
ms5837 - 30ba ul tra small gel filled pressure sensor sensor solutions /// ms5837 - 30ba 03/12/2015 7 pressure and tempera ture calculation flow chart for pressure and temperature reading and software compensation. size [1] [bit] min max c1 pressure sensitiv ity | sens t1 unsigned int 16 16 0 65535 34982 c2 pressure of f set | off t1 unsigned int 16 16 0 65535 36352 c3 temperature coef f icient of pressure sensitiv ity | tcs unsigned int 16 16 0 65535 20328 c4 temperature coef f icient of pressure of fset | tco unsigned int 16 16 0 65535 22354 c5 ref erence temperature | t ref unsigned int 16 16 0 65535 26646 c6 temperature coef f icient of the temperature | tempsens unsigned int 16 16 0 65535 26146 d1 digital pressure v alue unsigned int 32 24 0 16777215 4958179 d2 digital temperature v alue unsigned int 32 24 0 16777215 6815414 dt dif f erence between actual and ref erence temperature [2] dt = d2 - t ref = d2 - c5 * 2 8 signed int 32 25 - 16776960 16777215 - 5962 1981 = 19.81 c off of f set at actual temperature [3] off = off t1 + tco * dt = c2 * 2 16 + (c4 * dt ) / 2 7 signed int 64 41 - 17179344900 25769410560 2381326464 sens sensitiv ity at actual temperature [4] sens = sens t1 + tcs * dt = c1 * 2 15 + ( c3 * dt ) / 2 8 signed int 64 41 - 8589672450 12884705280 1145816755 39998 = 3999.8 mbar notes [1] [2] [3] [4] min and max hav e to be def ined min and max hav e to be def ined maximal size of intermediate result during ev aluation of v ariable 300000 0 58 p recommended variable type description | equation signed int 32 actual temperature ( - 4085c with 0.01c resolution) temp = 20c+dt*tempsens = 2000+ dt * c6 /2 23 read digital pressure and temperature data signed int 32 temperature compensated pressure (030 bar with 0.25mbar resolution) p = d1 * sens - off = (d1 * sens / 2 21 - off) / 2 13 min and max hav e to be def ined convert calibration data into coefficients (see bit pattern of w1 to w4) variable example / typical value calculate temperature compensated pressure 8500 - 4000 temp 41 start maximum v alues f or calculation results: p min = 0 bar p max = 30 bar t min = - 20c t max = 85c t ref = 20c read calibration data (factory calibrated) from prom read digital pressure and temperature data calculate temperature calculate temperature compensated pressure display pressure and temperature value
ms5837 - 30ba ul tra small gel filled pressure sensor sensor solutions /// ms5837 - 30ba 03/12/2015 8 second order temperature compensation flow chart for pressure and temperature to the optimum accuracy. yes no sens i = 5 ? (temp C 2000) 2 / 2 3 sens 2 = sens - sens i ( temp / 100) < 20c low temperature off i = 1 ? (temp C 2000) 2 / 2 4 off i = 3 ? (temp C 2000) 2 / 2 1 off 2 = off - off i temp 2 = ( temp C t i) / 100 [c] low temperature high temper ature calculate pressure and temperature 2 nd order ( temp / 100) < - 15c no yes off i = off i + 7 ? (temp + 1500) 2 very low temperature sens i = 0 t i = 3 ? dt 2 / 2 33 t i = 2 ? dt 2 / 2 37 sens i = sens i + 4 ? (temp + 1500) 2 pressure and temperature parameters value s first order: off, sens and temp p2 = ((( d1 ? sens2 ) / 2 21 C off2) / 2 13 ) / 10 [mbar ]
ms5837 - 30ba ul tra small gel filled pressure sensor sensor solutions /// ms5837 - 30ba 03/12/2015 9 i 2 c interface commands the ms5837 - 30ba has only five basic commands: 1. reset 2. read prom (112 bit of calibration words) 3. d1 conversion 4. d2 conversion 5. read adc result (24 bit pressure / temperature) each i 2 c communication message starts with the start condition and it is ended with t he stop condition. the ms5837 - 30ba address is 1 110110x (write: x=0, read: x=1). size of each command is 1 byte (8 bits) as described in the table below. after adc read commands, the device will return 24 bit result and after the prom read 16 bit results. the address of the prom is embedded inside of t he prom read command using the a2, a1 and a0 bits. command byte hex value bit number 0 1 2 3 4 5 6 7 bit name pro m co nv - typ ad2/ os2 ad1/ os1 ad0/ os0 stop command reset 0 0 0 1 1 1 1 0 0x1e convert d1 (osr=256) 0 1 0 0 0 0 0 0 0x40 convert d1 (osr=512) 0 1 0 0 0 0 1 0 0x42 convert d1 (osr=1024) 0 1 0 0 0 1 0 0 0x44 convert d1 (osr=2048) 0 1 0 0 0 1 1 0 0x46 convert d1 (osr=4096) 0 1 0 0 1 0 0 0 0x48 convert d1 (osr=8192) 0 1 0 0 1 0 1 0 0x4a convert d2 (osr=256) 0 1 0 1 0 0 0 0 0x50 convert d2 (osr=512) 0 1 0 1 0 0 1 0 0x52 convert d2 (osr=1024) 0 1 0 1 0 1 0 0 0x54 convert d2 (osr=2048) 0 1 0 1 0 1 1 0 0x56 convert d2 (osr=4096) 0 1 0 1 1 0 0 0 0x58 convert d2 (osr=8192) 0 1 0 1 1 0 1 0 0x5a adc read 0 0 0 0 0 0 0 0 0x00 prom read 1 0 1 0 ad2 ad1 ad0 0 0xa0 to 0xae command structure
ms5837 - 30ba ul tra small gel filled pressure sensor sensor solutions /// ms5837 - 30ba 03/12/2015 10 reset sequence the res et sequenc e shall be sent once after power - on to make sure that the calibration prom gets loaded into the internal register. it can be also used to reset the device prom from an unknown condition. the reset can be sent at any time. in the event that there is not a successful power on res et this may be caused by the sda being blocked by the module in the acknowledge state. the only way to get the ms5837 - 30ba to functio n is to send several scls followed by a reset sequence or to repeat power on reset. i 2 c reset command prom read sequence the read command for p rom shall be executed once after reset by the user to read the content of the calibration prom and to calcu late the calibration coefficients. there are in total 7 addresses resulting in a total memory of 112 bit. addresses contain factory data and the setup, calibration coefficients, the serial code and crc. the command sequence is 8 bits long with a 16 bit res ult which is clocked with the msb first. the p rom read command consists of two parts. first command sets up the system into prom read mode. the second part gets the data from the system. i 2 c command to read memory address= 011 i 2 c answer from ms5837 - 30ba 1 1 1 0 1 1 0 0 0 0 0 0 1 1 1 1 0 0 s w a a p from master s = start condition w = write a = acknowledge from slave p = stop condition r = read n = not acknowledge cmd byte device address device address command 1 1 1 0 1 1 0 0 0 1 0 1 0 0 1 1 0 0 s w a a p from master s = start condition w = write a = acknowledge from slave p = stop condition r = read n = not acknowledge device address device address cmd byte command 1 1 1 0 1 1 0 1 0 x x x x x x x x 0 x x x x x x x x 0 s r a a n p from master s = start condition w = write a = acknowledge from slave p = stop condition r = read n = not acknowledage memory bit 7 - 0 device address device address memory bit 15 - 8 data data
ms5837 - 30ba ul tra small gel filled pressure sensor sensor solutions /// ms5837 - 30ba 03/12/2015 11 conversion sequence the conversion command is used to initiate uncompensated pressure (d1) or uncompensated temperature (d2) conversion. after the conversion, using adc read command the result is clocked out with the msb first. if the conver sion is not executed before the adc read command, or the adc read command is repeated, it will give 0 as the output result. if the a dc read command is sent during conversion the result will be 0, the conversion will not stop and the final result will be wr ong. conversion sequence sent during the already started conversion process will yield incorrect result as well. a conversion can be started by sending the command to ms5837 - 30ba. when command is sent to the system it stays busy until conversion is done. w hen conversion is finished the data can be accessed by sending a read command, when acknowledge is sent from the ms5837 - 30ba, 24 s cl cycles may be sent to receive all result bits. every 8 bits the system waits for an acknowledge signal. i 2 c command to initiate a pressure conversion (osr=4096, typ=d1) i 2 c adc read sequence i 2 c answer from ms5837 - 30ba 1 1 1 0 1 1 0 1 0 x x x x x x x x 0 x x x x x x x x 0 x x x x x x x x 0 s r a a a n p f rom m aster s = s tart c ondition w = write a = a cknow ledge f rom s lave p = s top c ondition r = read n = n ot a cknow ledge data 7 - 0 data 15 - 8 dev ice a ddress dev ice a ddress data data data 23 - 16 data 1 1 1 0 1 1 0 0 0 0 1 0 0 1 0 0 0 0 s w a a p from master s = start condition w = write a = acknowledge from slave p = stop condition r = read n = not acknowledge cmd byte device address device address command 1 1 1 0 1 1 0 0 0 0 0 0 0 0 0 0 0 0 s w a a p from master s = start condition w = write a = acknowledge from slave p = stop condition r = read n = not acknowledge device address device address cmd byte command
ms5837 - 30ba ul tra small gel filled pressure sensor sensor solutions /// ms5837 - 30ba 03/12/2015 12 cyclic redundancy check (crc) ms5837 - 30ba contains a prom memory with 112 - bit. a 4 - bit crc has been implemented to check the data validity in memory. the besides c code describes in detail crc - 4 calculation. c6 d b 1 5 d b 1 4 d b 1 3 d b 1 2 d b 1 1 d b 1 0 d b 9 d b 8 d b 7 d b 6 d b 5 d b 4 d b 3 d b 2 d b 1 d b 0 0 crc factory defined 1 c1 2 c2 3 c3 4 c4 5 c5 6 memory prom mapping c code example for crc - 4 calculation: unsigned char crc4( unsigned int n_prom[]) // n_prom defined as 8x unsigned int (n_prom[8]) { int cnt; // simple counter unsigned int n_rem=0; // crc remainder unsigned char n_bit; n_prom[0]=((n_prom[0]) & 0x0fff); // crc byte is replaced by 0 n_prom[7]=0; // subsidiary value, set to 0 for (cnt = 0; cnt < 16; cnt++) // operation is performed on bytes { // choose lsb or msb if (cnt%2==1) n_rem ^= ( unsigned short ) ((n_prom[cnt>>1]) & 0x00ff); else n_rem ^= ( unsigned short ) (n_prom[cnt>>1]>>8); for (n_bit = 8; n_bit > 0; n_bit -- ) { if (n_rem & (0x8000)) n_rem = (n_rem << 1) ^ 0x3000; else n_rem = (n_rem << 1); } } n_rem= ((n_rem >> 12) & 0x000f); // final 4 - bit remainder is crc code return (n_rem ^ 0x00); }
ms5837 - 30ba ul tra small gel filled pressure sensor sensor solutions /// ms5837 - 30ba 03/12/2015 13 application circuit the ms5837 is a circuit that can be used in conjunction with a microcontroller in mobile altimeter applications. typical application circuit pin configuration and device package outline unless otherwise specified dimensions are in millimeters. general tolerance 0 .1 1 gnd ground 2 vdd positive supply 3 scl i2c clock 4 sda i2c data package outlines and pin configuration
ms5837 - 30ba ul tra small gel filled pressure sensor sensor solutions /// ms5837 - 30ba 03/12/2015 14 recommended pad layout pad layout for bottom side of the ms5837 - 30ba soldered onto printed circuit board. recommended pcb footprint shipping package
ms5837 - 30ba ul tra small gel filled pressure sensor sensor solutions /// ms5837 - 30ba 03/12/2015 15 mounting and assembly considerations soldering please refer to the application note an808 available on our website for all soldering recommendations. mounting the ms5837 - 30ba can be placed with automatic pick & place equipment using vacuum nozzles. it will not be damaged by th e vacuum. due to the low stress assembly the sensor does not show pressure hysteresis effects. it is important to solder all contact pads. connection to pcb the package outline of the module allows the us e of a flexible p cb for interconnection. this can b e important for applications in watches and other special devices. sealing with o - rings in applications such as outdoor watches the electronics must be protected against direct water or humidity. for such applications the ms5837 - 30ba provides the possibility to seal with an o - ring. the o - ring shall be placed at the groove location, i.e. the small outer diameter of the metal lid. the following o - ring / housing dimensions are recommended: o - ring inner diameter 1.8 0.05 mm o - ring cross - section diameter 0.8 0.03 mm housing bore diameter 3.07 0.03 mm please refer to the application note an523 available on our website for o - ring mounting recommendations. cleaning the ms 5837 - 30ba has been manufactured under clean - room conditions. it is the refore recommended to assemble the sensor under class 10000 or better conditions. should this not be possible, it is recommended to protect the sensor opening during assembly from entering particles and dust. to avoid cleaning of the p cb, solder paste of type no - clean shall be used. warning: cleaning might damage the sensor. esd precautions the electrical contact pads are protected against esd up to 2 kv hbm (human body model). it is therefore essential to ground machines and personnel properly during assembly and handling of the device. the ms5837 - 30ba is shipped in antistatic transport boxes. any test adapters or production transport boxes used during the assembly of the sensor shall be of an equivalent antistatic material. decoupling capacitor particular care must be taken when connecting the device to the power supply. a minimum of 100nf ceramic capacitor must be placed as close as possible to the ms5837 - 30ba vdd pin. this capacitor will stabilize the power supply during data conversion and thu s, provide the highest possible accuracy.
ms5837 - 30ba ul tra small gel filled pressure sensor sensor solutions /// ms5837 - 30ba 03/12/2015 16 ordering information part number / art. number product delivery form ms583730ba01 - 50 ms5837 - 30ba ultra small gel filled pressure sensor tape & reel cdoc - da - 0093 7

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